In order to estimate the present size of the moulded interconnect device (MID) market, the study covered four main tasks. To gather data about the market, as well as its parent and peer markets, in-depth secondary research was conducted. The following stage involved conducting primary research to confirm these conclusions, hypotheses, and sizing with industry experts throughout the value chain. Two methodologies were utilised to approximate the overall market size: top-down and bottom-up. The size of the market for each section and subsegment was then estimated using data triangulation and market breakdown.
Numerous primary sources from the supply and demand sides were questioned during the main research phase to gather crucial qualitative and quantitative data for this report. Industry specialists including CEOs, VPs, marketing directors, directors of technology and innovation, and associated executives from significant firms and organisations in the moulded interconnect device (MID) sector were the main sources from the supply side. Following the completion of market engineering, which involved the computation of market statistics, market breakdown, market size estimates, market forecasting, and data triangulation, a significant amount of primary research was carried out in order to collect data and confirm and validate the crucial figures that were determined.
Several data triangulation techniques, in addition to top-down and bottom-up approaches, have been used throughout the market engineering process to estimate and validate the size of the dependent submarkets described in this study, as well as the moulded interconnect device (MID) market.
Molded Interconnect Device (MID) Market based on Product Type:
• Antennae & Connectivity Modules
• Sensors
• Connectors & Switches
• Lighting Systems
• Others
Molded Interconnect Device (MID) Market based on Process:
• Laser Direct Structuring (LDS)
• Two-Shot Molding
• Film Techniques
Molded Interconnect Device (MID) Market, by Vertical:
• Telecommunications
• Consumer Electronics
• Automotive
• Medical
• Industrial
• Military & Aerospace
Molded Interconnect Device (MID) Market based on Geography:
• North America
o US
o Canada
• Europe
o Germany
o UK
o France
o Italy
o Spain
o Rest of Europe (RoE)
• Asia Pacific (APAC)
o China
o Japan
o India
o Australia
o South Korea
o Rest of Asia Pacific (RoAPAC)
• Latin America (LATAM)
o Brazil
o Argentina
o Rest of South America
• Middle East and Africa (MEA)
o UAE
o Turkey
o Saudi Arabia
o South Africa
o Rest of Middle East & Africa
The market for moulded connecting devices is divided into product categories such as lighting systems, sensors, connectors & switches, antennas & connectivity modules, and others. The category that generated the largest revenue share in the moulded interconnect device market in 2021 was antennas & connectivity modules. MIDs allow for the creation of new functionality as well as the downsizing of products because they can integrate mechanical and electrical components into nearly any type of connecting device.
The moulded interconnect device market is divided into three segments based on process: film methods, two-shot moulding, and laser direct structuring (LDS). In 2021, the moulded interconnect device market had a sizable revenue share from the two-shot moulding segment. A reliable and well-established technique for creating MIDs that is both affordable and consistent is two-shot moulding. The part is being made in two-shot moulding using two distinct moulding cycles, various thermostatic polymers, and an electroless plating procedure.
The market for moulded interconnect devices is divided into the following vertical segments: consumer electronics, automotive, medical, industrial, military & aerospace, and telecommunications. With the largest revenue share in the moulded interconnect device market in 2021, the consumer electronics category held the top spot. Electronic gadgets intended for daily use, such as those for entertainment, communications, and workplace productivity, are known as consumer electronics. Consumer electronics include almost all electronic equipment used for work, play, and communication.
The cloud native storage market is examined in North America, Europe, Asia Pacific, and Latin America based on region. The market for moulded interconnect devices saw its highest revenue share in the Asia Pacific region in 2021. The main causes of this include a number of Asian OEMs as well as producers of semiconductor devices and goods. In especially in South Korea, Taiwan, and China, the area has excelled in offering the most cutting-edge semiconductor fabrication services as well as electronic system assembly services. In addition, semiconductor electronics manufacturers gain a great deal from outsourcing their production to places like Taiwan and China.
• This report illustrates the most vital attributes of the Molded Interconnect Device (MID) Market, which are driving and providing opportunities.
• This research gives an in-depth analysis of the Molded Interconnect Device (MID) Market growth on the basis of several segments in the market.
• This report presents the predictions of the past and present trends of the Molded Interconnect Device (MID) Market.
• This study also presents the competitive analysis, such as key strategies and capabilities of major players of the Molded Interconnect Device (MID) Market.
Table of Contents 1. Executive Summary 2. Industry Outlook 2.1. Industry Overview 2.2. Industry Trends 3. Market Snapshot 3.1. Market Definition 3.2. Market Outlook 3.2.1. Porter Five Forces 3.3. Related Markets 4. Market characteristics 4.1. Market Overview 4.2. Market Segmentation 4.3. Market Dynamics 4.3.1. Drivers 4.3.2. Restraints 4.3.3. Opportunities 4.4. DRO - Impact Analysis 5. Product Type: Market Size & Analysis 5.1. Overview 5.2. Antennae & Connectivity Modules 5.3. Sensors 5.4. Connectors & Switches 5.5. Lighting Systems 5.6. Others 6. Process: Market Size & Analysis 6.1. Overview 6.2. Laser Direct Structuring (LDS) 6.3. Two-Shot Molding 6.4. Film Techniques 7. Vertical : Market Size & Analysis 7.1. Overview 7.2. Telecommunications 7.3. Consumer Electronics 7.4. Automotive 7.5. Medical 7.6. Industrial 7.7. Military & Aerospace 8. Geography: Market Size & Analysis 8.1. Overview 8.2. North America (U.S., Mexico, Canada) 8.3. Europe (France, Germany, UK, Italy, Netherlands, Spain, Russia, Rest of Europe) 8.4. Asia Pacific (Japan, China, India, Australia, South East Asia, Rest of APAC) 8.5. Latin America (Brazil, Argentina) 8.6. Middle East & Africa (Saudi Arabia, UAE, South Africa, Rest of Middle East and Africa) 9. Competitive Landscape 9.1. Competitor Comparison Analysis 9.2. Market Developments 9.2.1. Mergers and Acquisitions, Legal, Awards, Partnerships 9.2.2. Product Launches and execution 10. Vendor Profiles 10.1. Molex (US) 10.1.1. Overview 10.1.2. Financial Overview 10.1.3. Product Offerings 10.1.4. Developments 10.1.5. Business Strategy 10.2. TE Connectivity (Switzerland) 10.2.1. Overview 10.2.2. Financial Overview 10.2.3. Product Offerings 10.2.4. Developments 10.2.5. Business Strategy 10.3. Amphenol Corporation (US) 10.3.1. Overview 10.3.2. Financial Overview 10.3.3. Product Offerings 10.3.4. Developments 10.3.5. Business Strategy 10.4. LPKF LASER & ELECTRONICS (GERMANY) 10.4.1. Overview 10.4.2. Financial Overview 10.4.3. Product Offerings 10.4.4. Developments 10.4.5. Business Strategy 10.5. Harting (Germany) 10.5.1. Overview 10.5.2. Financial Overview 10.5.3. Product Offerings 10.5.4. Developments 10.5.5. Business Strategy 10.6. Arlington Plating Company (US) 10.6.1. Overview 10.6.2. Financial Overview 10.6.3. Product Offerings 10.6.4. Developments 10.6.5. Business Strategy 10.7. MID Solutions (Germany) 10.7.1. Overview 10.7.2. Financial Overview 10.7.3. Product Offerings 10.7.4. Developments 10.7.5. Business Strategy 10.8. 2E Mechatronic (Germany) 10.8.1. Overview 10.8.2. Financial Overview 10.8.3. Product Offerings 10.8.4. Developments 10.8.5. Business Strategy 10.9. KYOCERA AVX (US) 10.9.1. Overview 10.9.2. Financial Overview 10.9.3. Product Offerings 10.9.4. Developments 10.9.5. Business Strategy 10.10. Taoglas (Dublin) 10.10.1. Overview 10.10.2. Financial Overview 10.10.3. Product Offerings 10.10.4. Developments 10.10.5. Business Strategy 11. Analyst Opinion 12. Annexure 12.1. Report Scope 12.2. Market Definitions 12.3. Research Methodology 12.3.1. Data Collation and In-house Estimation 12.3.2. Market Triangulation 12.3.3. Forecasting 12.4. Report Assumptions 12.5. Declarations 12.6. Stakeholders 12.7. LPKF Laser & Electronics (Germany) 12.8. Abbreviations
Tables TABLE 1. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 2. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR ANTENNAE & CONNECTIVITY MODULES, BY GEOGRAPHY, 2021-2030 (USD BILLION) TABLE 3. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR SENSORS, BY GEOGRAPHY, 2021-2030 (USD BILLION) TABLE 4. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR CONNECTORS & SWITCHES, BY GEOGRAPHY, 2021-2030 (USD BILLION) TABLE 5. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR LIGHTING SYSTEMS, BY GEOGRAPHY, 2021-2030 (USD BILLION) TABLE 6. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR OTHERS, BY GEOGRAPHY, 2021-2030 (USD BILLION) TABLE 7. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 8. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR LASER DIRECT STRUCTURING (LDS), 2021-2030 (USD BILLION) TABLE 9. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR TWO-SHOT MOLDING, BY GEOGRAPHY, 2021-2030 (USD BILLION) TABLE 10. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR FILM TECHNIQUES, 2021-2030 (USD BILLION) TABLE 11. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY VERTICAL, 2021-2030 (USD BILLION) TABLE 12. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR TELECOMMUNICATIONS, 2021-2030 (USD BILLION) TABLE 13. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR CONSUMER ELECTRONICS, BY GEOGRAPHY, 2021-2030 (USD BILLION) TABLE 14. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR AUTOMOTIVE, 2021-2030 (USD BILLION) TABLE 15. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR MEDICAL, 2021-2030 (USD BILLION) TABLE 16. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR INDUSTRIAL, 2021-2030 (USD BILLION) TABLE 17. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR MILITARY & AEROSPACE, 2021-2030 (USD BILLION) TABLE 18. NORTH AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY COUNTRY, 2021-2030 (USD BILLION) TABLE 19. NORTH AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 20. NORTH AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 21. U.S MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 22. U.S MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 23. CANADA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 24. CANADA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 25. MEXICO MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 26. MEXICO MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 27. EUROPE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY COUNTRY, 2021-2030 (USD BILLION) TABLE 28. EUROPE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 29. EUROPE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 30. GERMANY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 31. GERMANY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 32. U.K MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 33. U.K MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 34. FRANCE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 35. FRANCE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 36. ITALY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 37. ITALY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 38. SPAIN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 39. SPAIN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 40. ROE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 41. ROE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 42. ASIA PACIFIC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY COUNTRY, 2021-2030 (USD BILLION) TABLE 43. ASIA PACIFIC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 44. ASIA PACIFIC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 45. CHINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 46. CHINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 47. INDIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 48. INDIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 49. JAPAN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 50. JAPAN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 51. REST OF APAC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 52. REST OF APAC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 53. LATIN AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 54. LATIN AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 55. BRAZIL MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 56. BRAZIL MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 57. ARGENTINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 58. ARGENTINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 59. MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 60. MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 61. SAUDI ARABIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 62. SAUDI ARABIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 63. UAE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 64. UAE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 65. REST OF MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION) TABLE 66. REST OF MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION) TABLE 67. MOLEX (US): FINANCIALS TABLE 68. MOLEX (US): PRODUCTS & SERVICES TABLE 69. MOLEX (US): RECENT DEVELOPMENTS TABLE 70. TE CONNECTIVITY (SWITZERLAND): FINANCIALS TABLE 71. TE CONNECTIVITY (SWITZERLAND): PRODUCTS & SERVICES TABLE 72. TE CONNECTIVITY (SWITZERLAND): RECENT DEVELOPMENTS TABLE 73. AMPHENOL CORPORATION (US): FINANCIALS TABLE 74. AMPHENOL CORPORATION (US): PRODUCTS & SERVICES TABLE 75. AMPHENOL CORPORATION (US): RECENT DEVELOPMENTS TABLE 76. LPKF LASER & ELECTRONICS (GERMANY): FINANCIALS TABLE 77. LPKF LASER & ELECTRONICS (GERMANY): PRODUCTS & SERVICES TABLE 78. LPKF LASER & ELECTRONICS (GERMANY): RECENT DEVELOPMENTS TABLE 79. HARTING (GERMANY): FINANCIALS TABLE 80. HARTING (GERMANY): PRODUCTS & SERVICES TABLE 81. HARTING (GERMANY): RECENT DEVELOPMENTS TABLE 82. ARLINGTON PLATING COMPANY (US): FINANCIALS TABLE 83. ARLINGTON PLATING COMPANY (US): PRODUCTS & SERVICES TABLE 84. ARLINGTON PLATING COMPANY (US): RECENT DEVELOPMENTS TABLE 85. MID SOLUTIONS (GERMANY).: FINANCIALS TABLE 86. MID SOLUTIONS (GERMANY).: PRODUCTS & SERVICES TABLE 87. MID SOLUTIONS (GERMANY).: RECENT DEVELOPMENTS TABLE 88. 2E MECHATRONIC (GERMANY): FINANCIALS TABLE 89. 2E MECHATRONIC (GERMANY): PRODUCTS & SERVICES TABLE 90. 2E MECHATRONIC (GERMANY): RECENT DEVELOPMENTS TABLE 91. KYOCERA AVX (US): FINANCIALS TABLE 92. KYOCERA AVX (US): PRODUCTS & SERVICES TABLE 93. KYOCERA AVX (US): RECENT DEVELOPMENTS TABLE 94. TAOGLAS (DUBLIN): FINANCIALS TABLE 95. TAOGLAS (DUBLIN): PRODUCTS & SERVICES TABLE 96. TAOGLAS (DUBLIN): RECENT DEVELOPMENTS
Publisher: Infoholic Research
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