According to the report titled ‘Global Hermetic packaging Market Size study, by Configuration ( Multilayer Ceramic Packages , Pressed Ceramic Packages, Metal Can Packages), by Type ( Passivation Glass, Reed Glass, Transponder Glass, Glass-Metal Sealing (GTMS), Ceramic-Metal Sealing (CERTM), by Application (Transistors, Sensors, Lasers, Airbag Ignitors, Photo Diodes Oscillating Crystals, MEMS Switch, Others), by Industry ( Military & Defense, Aeronautics & Space, Automotive, Energy & Nuclear Safety, Medical, Telecommunication, Consumer Electronics, Others) and Regional Forecasts 2020-2027’, available with Market Study Report, global hermetic packaging market was worth USD 3.4 billion in 2019 and is expected to record a 4.3% CAGR during 2020-2027.
 

Surging demand for advanced packaging solutions for better durability and enhanced performance of electronics, in consort with extensive usage of the technique in commercial, industrial, aerospace, and defense applications are the key factors driving the growth of global hermetic packaging market.
 

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Notably, hermetic packaging is primarily used in active and passive electronic devices as well as in electronics and semiconductor industries. Hermetic materials protect against numerous environmental factors like change in air pressure, moisture, soil/grim, and other natural hazards which are likely to damage delicate electronics or disrupt electrical contacts inside hermetic materials. The packaging has found applications in automotive, aeronautics, telecommunications, and space components verticals, which is propelling global hermetic packaging industry expansion.
 

As per the report, leading organizations are focusing on tactics such as merger & acquisition, innovations, and product launches to gain a competitive edge, facilitating the business scenario. However, availability of alternate packaging solutions is predicted to restrain the industry growth over the study period.
 

Citing the geographic terrain, worldwide hermetic packaging market sphere is segmented into Asia Pacific, Europe, Latin America, North America, and Rest of the World. The report claims that North America is poised to accrue notable gains over the estimated timeframe, owing to prompt adoption of technology and presence of many aerospace firms in the region.
 

Meanwhile, Asia Pacific hermetic packaging industry is anticipated to register a decent growth rate through 2027, on account of surging demand for energy, emerging economies, and rising expenditure on defense.
 

Leading organizations influencing global hermetic packaging market trends are Legacy Technologies Inc., Micross Components Inc., Egide SA, Materion Corporation, Kyocera Corporation, Teledyne Technologies Inc., Texas Instruments Incorporated, Amkor Technology Inc., AMETEK Inc., and SCHOTT AG.