According to the latest research report titled ‘Advanced Packaging Market Size By Packaging Type, By Application, Industry Analysis Report, Regional Outlook, Application Potential, Competitive Market Share & Forecast, 2020 - 2026’, available with Market Study Report, global advanced packaging market is anticipated record a healthy growth rate through 2026.
 

Escalating demand for advanced & miniaturized semiconductor components in consumer electronics, developments in 2.5D/3D technology, rising penetration of 5G technology, upsurge in demand for automotive components, and favorable government initiatives are the major growth drivers of global advanced packaging market.
 

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Based on packaging type, fan-in wafer level (WLP) segment accounted for 10% of global advanced packaging market share in 2019 and is expected to gain considerable traction over the forecast duration. The growth is largely driven by increasing product adoption by smartphone manufacturers to obtain high density chipsets with a minimal footprint. This is possible through fan-in wafer-level technology as it involves packaging an IC (integrated circuit) at wafer level. Wafer level packaging is an efficient batch process wherein each device is packaged on the wafer simultaneously.
 

Speaking of the application spectrum, healthcare segment held 5% of global advanced packaging industry share in 2019 and is expected to grow tremendously in the upcoming years. Rising integration of AI chipsets across healthcare applications mostly for remote monitoring along with increasing demand for better & miniaturized devices is stimulating the segment growth.
 

From a regional frame of reference, global advanced packaging market size spans across North America, Europe, Asia Pacific, and LAMEA. As per trusted sources, LAMEA market captured 5% of the overall share in 2019 and is expected to expand at a robust pace during the analysis period. The growth is primarily creditable to increasing government initiatives aimed at promoting the expansion of regional semiconductor industry. 
 

Prominent players in worldwide advanced packaging market are UTAC Group, Tongfu Microelectronics Co., Ltd., Siliconware Precision Industries Co., Ltd., Sigurd Microelectronics Corp., SFA Semicon Philippines Corp., Sanmina Corp., Powertech Technology Inc., JCET Group Co., Ltd., Greatek Electronics., Inc., Deca Technologies, Inc., ChipMOS Technologies Inc., Chipbond Technology Corp., China Wafer Level CSP Co., Ltd., Brewer Science, Inc., ASE Group, and Amcor Technology, Inc.