Global (United States, European Union and China) 3D IC and 2.5D IC Market Research Report 2019-2025

Choose License

In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
3D TSV in 3D IC and 2.5D IC market is estimated to grow at the highest CAGR during the forecast period
In terms of geographic regions, Asia-Pacific acquired largest market for 3D IC and 2.5D IC in 2018.The large market in Asia-Pacific is owing to the broad scope of 3D IC and 2.5D IC packages in various consumer electronics applications, particularly in smartphones and tablets.
In 2019, the market size of 3D IC and 2.5D IC is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 3D IC and 2.5D IC. 

This report studies the global market size of 3D IC and 2.5D IC, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the 3D IC and 2.5D IC production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

In global market, the following companies are covered: 
    TSMC (Taiwan)
    Samsung (South Korea)
    Toshiba (Japan)
    ASE Group (Taiwan)
    Amkor (U.S.)
    UMC (Taiwan)
    Stmicroelectronics (Switzerland)
    Broadcom (U.S.)
    Intel (U.S.)
    Jiangsu Changjiang Electronics (China)

Market Segment by Product Type
    3D wafer-level chip-scale packaging
    3D TSV
    2.5D

Market Segment by Application
    Consumer electronics
    Telecommunication
    Industry sector
    Automotive
    Military and Aerospace
    Smart technologies
    Medical devices

Key Regions split in this report: breakdown data for each region.
    United States
    China
    European Union
    Rest of World (Japan, Korea, India and Southeast Asia)

The study objectives are:
    To analyze and research the 3D IC and 2.5D IC status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
    To present the key 3D IC and 2.5D IC manufacturers, presenting the sales, revenue, market share, and recent development for key players.
    To split the breakdown data by regions, type, companies and applications 
    To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
    To identify significant trends, drivers, influence factors in global and regions
    To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

In this study, the years considered to estimate the market size of 3D IC and 2.5D IC are as follows:
    History Year: 2014-2018
    Base Year: 2018
    Estimated Year: 2019
    Forecast Year 2019 to 2025
Table of Contents

1 Report Overview
    1.1 Research Scope
    1.2 Major Manufacturers Covered in This Report
    1.3 Market Segment by Type
        1.3.1 Global 3D IC and 2.5D IC Market Size Growth Rate by Type (2019-2025)
        1.3.2 3D wafer-level chip-scale packaging
        1.3.3 3D TSV
        1.3.4 2.5D
    1.4 Market Segment by Application
        1.4.1 Global 3D IC and 2.5D IC Market Share by Application (2019-2025)
        1.4.2 Consumer electronics
        1.4.3 Telecommunication
        1.4.4 Industry sector
        1.4.5 Automotive
        1.4.6 Military and Aerospace
        1.4.7 Smart technologies
        1.4.8 Medical devices
    1.5 Study Objectives
    1.6 Years Considered

2 Global Growth Trends
    2.1 Production and Capacity Analysis
        2.1.1 Global 3D IC and 2.5D IC Production Value 2014-2025
        2.1.2 Global 3D IC and 2.5D IC Production 2014-2025
        2.1.3 Global 3D IC and 2.5D IC Capacity 2014-2025
        2.1.4 Global 3D IC and 2.5D IC Marketing Pricing and Trends
    2.2 Key Producers Growth Rate (CAGR) 2019-2025
        2.2.1 Global 3D IC and 2.5D IC Market Size CAGR of Key Regions
        2.2.2 Global 3D IC and 2.5D IC Market Share of Key Regions
2.3 Industry Trends
        2.3.1 Market Top Trends
        2.3.2 Market Drivers

3 Market Share by Manufacturers
    3.1 Capacity and Production by Manufacturers
        3.1.1 Global 3D IC and 2.5D IC Capacity by Manufacturers
        3.1.2 Global 3D IC and 2.5D IC Production by Manufacturers
    3.2 Revenue by Manufacturers
        3.2.1 3D IC and 2.5D IC Revenue by Manufacturers (2014-2019)
        3.2.2 3D IC and 2.5D IC Revenue Share by Manufacturers (2014-2019)
        3.2.3 Global 3D IC and 2.5D IC Market Concentration Ratio (CR5 and HHI)
    3.3 3D IC and 2.5D IC Price by Manufacturers
    3.4 Key Manufacturers 3D IC and 2.5D IC Plants/Factories Distribution and Area Served
    3.5 Date of Key Manufacturers Enter into 3D IC and 2.5D IC Market
    3.6 Key Manufacturers 3D IC and 2.5D IC Product Offered
    3.7 Mergers & Acquisitions, Expansion Plans

4 Market Size by Type
    4.1 Production and Production Value for Each Type
        4.1.1 3D wafer-level chip-scale packaging Production and Production Value (2014-2019)
        4.1.2 3D TSV Production and Production Value (2014-2019)
        4.1.3 2.5D Production and Production Value (2014-2019)
    4.2 Global 3D IC and 2.5D IC Production Market Share by Type
    4.3 Global 3D IC and 2.5D IC Production Value Market Share by Type
    4.4 3D IC and 2.5D IC Ex-factory Price by Type

5 Market Size by Application
    5.1 Overview
    5.2 Global 3D IC and 2.5D IC Consumption by Application

6 Production by Regions
    6.1 Global 3D IC and 2.5D IC Production (History Data) by Regions 2014-2019
    6.2 Global 3D IC and 2.5D IC Production Value (History Data) by Regions
    6.3 United States
        6.3.1 United States 3D IC and 2.5D IC Production Growth Rate 2014-2019
        6.3.2 United States 3D IC and 2.5D IC Production Value Growth Rate 2014-2019
        6.3.3 Key Players in United States
        6.3.4 United States 3D IC and 2.5D IC Import & Export
    6.4 European Union
        6.4.1 European Union 3D IC and 2.5D IC Production Growth Rate 2014-2019
        6.4.2 European Union 3D IC and 2.5D IC Production Value Growth Rate 2014-2019
        6.4.3 Key Players in European Union
        6.4.4 European Union 3D IC and 2.5D IC Import & Export
    6.5 China
        6.5.1 China 3D IC and 2.5D IC Production Growth Rate 2014-2019
        6.5.2 China 3D IC and 2.5D IC Production Value Growth Rate 2014-2019
        6.5.3 Key Players in China
        6.5.4 China 3D IC and 2.5D IC Import & Export
    6.6 Rest of World
        6.6.1 Japan
        6.6.2 Korea
        6.6.3 India
        6.6.4 Southeast Asia

7 3D IC and 2.5D IC Consumption by Regions
    7.1 Global 3D IC and 2.5D IC Consumption (History Data) by Regions
   7.2 United States
        7.2.1 United States 3D IC and 2.5D IC Consumption by Type
        7.2.2 United States 3D IC and 2.5D IC Consumption by Application
    7.3 European Union
        7.3.1 European Union 3D IC and 2.5D IC Consumption by Type
        7.3.2 European Union 3D IC and 2.5D IC Consumption by Application
   7.4 China
        7.4.1 China 3D IC and 2.5D IC Consumption by Type
        7.4.2 China 3D IC and 2.5D IC Consumption by Application
   7.5 Rest of World
        7.5.1 Rest of World 3D IC and 2.5D IC Consumption by Type
        7.5.2 Rest of World 3D IC and 2.5D IC Consumption by Application
        7.5.1 Japan
        7.5.2 Korea
        7.5.3 India
        7.5.4 Southeast Asia

8 Company Profiles
    8.1 TSMC (Taiwan)
        8.1.1 TSMC (Taiwan) Company Details
        8.1.2 Company Description and Business Overview
        8.1.3 Production and Revenue of 3D IC and 2.5D IC
        8.1.4 3D IC and 2.5D IC Product Introduction
        8.1.5 TSMC (Taiwan) Recent Development
    8.2 Samsung (South Korea)
        8.2.1 Samsung (South Korea) Company Details
        8.2.2 Company Description and Business Overview
        8.2.3 Production and Revenue of 3D IC and 2.5D IC
        8.2.4 3D IC and 2.5D IC Product Introduction
        8.2.5 Samsung (South Korea) Recent Development
    8.3 Toshiba (Japan)
        8.3.1 Toshiba (Japan) Company Details
        8.3.2 Company Description and Business Overview
        8.3.3 Production and Revenue of 3D IC and 2.5D IC
        8.3.4 3D IC and 2.5D IC Product Introduction
        8.3.5 Toshiba (Japan) Recent Development
    8.4 ASE Group (Taiwan)
        8.4.1 ASE Group (Taiwan) Company Details
        8.4.2 Company Description and Business Overview
        8.4.3 Production and Revenue of 3D IC and 2.5D IC
        8.4.4 3D IC and 2.5D IC Product Introduction
        8.4.5 ASE Group (Taiwan) Recent Development
    8.5 Amkor (U.S.)
        8.5.1 Amkor (U.S.) Company Details
        8.5.2 Company Description and Business Overview
        8.5.3 Production and Revenue of 3D IC and 2.5D IC
        8.5.4 3D IC and 2.5D IC Product Introduction
        8.5.5 Amkor (U.S.) Recent Development
    8.6 UMC (Taiwan)
        8.6.1 UMC (Taiwan) Company Details
        8.6.2 Company Description and Business Overview
        8.6.3 Production and Revenue of 3D IC and 2.5D IC
        8.6.4 3D IC and 2.5D IC Product Introduction
        8.6.5 UMC (Taiwan) Recent Development
    8.7 Stmicroelectronics (Switzerland)
        8.7.1 Stmicroelectronics (Switzerland) Company Details
        8.7.2 Company Description and Business Overview
        8.7.3 Production and Revenue of 3D IC and 2.5D IC
        8.7.4 3D IC and 2.5D IC Product Introduction
        8.7.5 Stmicroelectronics (Switzerland) Recent Development
    8.8 Broadcom (U.S.)
        8.8.1 Broadcom (U.S.) Company Details
        8.8.2 Company Description and Business Overview
        8.8.3 Production and Revenue of 3D IC and 2.5D IC
        8.8.4 3D IC and 2.5D IC Product Introduction
        8.8.5 Broadcom (U.S.) Recent Development
    8.9 Intel (U.S.)
        8.9.1 Intel (U.S.) Company Details
        8.9.2 Company Description and Business Overview
        8.9.3 Production and Revenue of 3D IC and 2.5D IC
        8.9.4 3D IC and 2.5D IC Product Introduction
        8.9.5 Intel (U.S.) Recent Development
    8.10 Jiangsu Changjiang Electronics (China)
        8.10.1 Jiangsu Changjiang Electronics (China) Company Details
        8.10.2 Company Description and Business Overview
        8.10.3 Production and Revenue of 3D IC and 2.5D IC
        8.10.4 3D IC and 2.5D IC Product Introduction
        8.10.5 Jiangsu Changjiang Electronics (China) Recent Development

9 Market Forecast
    9.1 Global Market Size Forecast
        9.1.1 Global 3D IC and 2.5D IC Capacity, Production Forecast 2019-2025
        9.1.2 Global 3D IC and 2.5D IC Production Value Forecast 2019-2025
    9.2 Market Forecast by Regions
        9.2.1 Global 3D IC and 2.5D IC Production and Value Forecast by Regions 2019-2025
        9.2.2 Global 3D IC and 2.5D IC Consumption Forecast by Regions 2019-2025
    9.3 United States
        9.3.1 Production and Value Forecast in United States
        9.3.2 Consumption Forecast in United States
    9.4 European Union
        9.4.1 Production and Value Forecast in European Union
        9.4.2 Consumption Forecast in European Union
    9.5 China
        9.5.1 Production and Value Forecast in China
        9.5.2 Consumption Forecast in China
    9.6 Rest of World
        9.6.1 Japan
        9.6.2 Korea
        9.6.3 India
        9.6.4 Southeast Asia
    9.7 Forecast by Type
        9.7.1 Global 3D IC and 2.5D IC Production Forecast by Type
        9.7.2 Global 3D IC and 2.5D IC Production Value Forecast by Type
    9.8 Consumption Forecast by Application

10 Value Chain and Sales Channels Analysis
    10.1 Value Chain Analysis
    10.2 Sales Channels Analysis
        10.2.1 3D IC and 2.5D IC Sales Channels
        10.2.2 3D IC and 2.5D IC Distributors
    10.3 3D IC and 2.5D IC Customers

11 Opportunities & Challenges, Threat and Affecting Factors
    11.1 Market Opportunities
    11.2 Market Challenges
    11.3 Porter's Five Forces Analysis

12 Key Findings

13 Appendix
    13.1 Research Methodology
        13.1.1 Methodology/Research Approach
            13.1.1.1 Research Programs/Design
            13.1.1.2 Market Size Estimation
            13.1.1.3 Market Breakdown and Data Triangulation
        13.1.2 Data Source
            13.1.2.1 Secondary Sources
            13.1.2.2 Primary Sources
    13.2 Author Details
    13.3 Disclaimer

List of Tables and Figures Figure 3D IC and 2.5D IC Product Picture Table 3D IC and 2.5D IC Key Market Segments Table Major Manufacturers 3D IC and 2.5D IC Covered in This Report Table Global 3D IC and 2.5D IC Market Size Growth Rate by Type 2019-2025 (K Units) & (Million US$) Figure Global 3D IC and 2.5D IC Sales Market Shar by Type 2014-2025 Figure 3D wafer-level chip-scale packaging Figures Table Major Manufacturers of 3D wafer-level chip-scale packaging Figure 3D TSV Figures Table Major Manufacturers of 3D TSV Figure 2.5D Figures Table Major Manufacturers of 2.5D Table Global 3D IC and 2.5D IC Market Share by Application 2019-2025 (K Units) Figure Consumer electronics Use Case Figure Telecommunication Use Case Figure Industry sector Use Case Figure Automotive Use Case Figure Military and Aerospace Use Case Figure Smart technologies Use Case Figure Medical devices Use Case Figure 3D IC and 2.5D IC Report Years Considered Figure Global 3D IC and 2.5D IC Production Value Growth Rate 2014-2025 (Million US$) Figure Global 3D IC and 2.5D IC Production 2014-2025 (K Units) Figure Global 3D IC and 2.5D IC Capacity 2014-2025 (K Units) Table Key Manufacturers 3D IC and 2.5D IC Capacity (K Units) Figure Global 3D IC and 2.5D IC Price 2014-2025 (USD/Unit) Table Global 3D IC and 2.5D IC Market Size of Key Regions (Million USD) & (K Units) Table Global 3D IC and 2.5D IC Growth Rate of Key Regions 2019-2025 (Million USD) Table Global 3D IC and 2.5D IC Market Share for of Regions 2019-2025 (K Units) Table Market Top Trends Table Global 3D IC and 2.5D IC Capacity by Manufacturers (2014-2019) (K Units) Table Global 3D IC and 2.5D IC Capacity Market Share by Manufacturers (2014-2019) Table Global 3D IC and 2.5D IC Production by Manufacturers (2014-2019) (K Units) Table Global 3D IC and 2.5D IC Production Share by Manufacturers (2014-2019) Figure Global 3D IC and 2.5D IC Production Share by Manufacturers in 2018 Table 3D IC and 2.5D IC Revenue by Manufacturers (2014-2019) (Million USD) Table 3D IC and 2.5D IC Revenue Share by Manufacturers (2014-2019) Figure 3D IC and 2.5D IC Value Share by Manufacturers in 2018 Table Global 3D IC and 2.5D IC Manufacturers Market Concentration Ratio (CR5 and HHI) Table 3D IC and 2.5D IC Price by Manufacturers 2014-2019 (USD/Unit) Table Key Manufacturers 3D IC and 2.5D IC Plants/Factories Distribution Table Key Manufacturers 3D IC and 2.5D IC Area Served Table Date of Key Manufacturers Enter into 3D IC and 2.5D IC Market Table Key Manufacturers 3D IC and 2.5D IC Product Type Table Mergers & Acquisitions, Expansion Plans Table Global 3D wafer-level chip-scale packaging Production and Production Value (2014-2019) (K Units) & (Million US$) Table Global 3D TSV Production and Production Value (2014-2019) (K Units) & (Million US$) Table Global 2.5D Production and Production Value (2014-2019) (K Units) & (Million US$) Table Global 3D IC and 2.5D IC Production by Type (2014-2019) (K Units) Table Global 3D IC and 2.5D IC Production Share by Type (2014-2019) Figure Global 3D IC and 2.5D IC Production Market Share by Type (2014-2019) Figure Global 3D IC and 2.5D IC Production Market Share by Type in 2018 Table Global 3D IC and 2.5D IC Production Value by Type (2014-2019) (Million US$) Table Global 3D IC and 2.5D IC Production Value Share by Type (2014-2019) Figure Global 3D IC and 2.5D IC Production Value Market Share by Type (2014-2019) Figure Global 3D IC and 2.5D IC Production Value Market Share by Type in 2018 Table 3D IC and 2.5D IC Ex-factory Price by Type 2014-2019 (USD/Unit) Table Global 3D IC and 2.5D IC Consumption by Application (2014-2019) (K Units) Table Global 3D IC and 2.5D IC Consumption Share by Application (2014-2019) Figure Global Consumption 3D IC and 2.5D IC Market Share by Application (2014-2019) Table Global 3D IC and 2.5D IC Production by Regions 2014-2019 (K Units) Table Global 3D IC and 2.5D IC Production Market Share by Regions 2014-2019 Figure Global 3D IC and 2.5D IC Production Market Share by Regions 2014-2019 Figure Global 3D IC and 2.5D IC Production Market Share by Regions in 2018 Table Global 3D IC and 2.5D IC Production Value by Regions 2014-2019 (Million USD) Table Global 3D IC and 2.5D IC Production Value Market Share by Regions 2014-2019 Figure Global 3D IC and 2.5D IC Production Value Market Share by Regions 2014-2019 Figure Global 3D IC and 2.5D IC Production Value Market Share by Regions in 2018 Table United States 3D IC and 2.5D IC Production and Value 2014-2019 (K Units) & (Million USD) Figure United States 3D IC and 2.5D IC Production Growth Rate 2014-2019 (K Units) Figure United States 3D IC and 2.5D IC Production Value Growth Rate 2014-2019 (Million USD) Table United States 3D IC and 2.5D IC Import & Export (K Units) Table European Union 3D IC and 2.5D IC Production and Value 2014-2019 (K Units) & (Million USD) Figure European Union 3D IC and 2.5D IC Production Growth Rate 2014-2019 (K Units) Figure European Union 3D IC and 2.5D IC Production Value Growth Rate 2014-2019 (Million USD) Table European Union 3D IC and 2.5D IC Import & Export (K Units) Table China 3D IC and 2.5D IC Production and Value 2014-2019 (K Units) & (Million USD) Figure China 3D IC and 2.5D IC Production Growth Rate 2014-2019 (K Units) Figure China 3D IC and 2.5D IC Production Value Growth Rate 2014-2019 (Million USD) Table China 3D IC and 2.5D IC Import & Export (K Units) Figure Japan 3D IC and 2.5D IC Production Growth Rate 2014-2019 (K Units) Figure Japan 3D IC and 2.5D IC Production Value Growth Rate 2014-2019 (Million USD) Figure Korea 3D IC and 2.5D IC Production Growth Rate 2014-2019 (K Units) Figure Korea 3D IC and 2.5D IC Production Value Growth Rate 2014-2019 (Million USD) Figure India 3D IC and 2.5D IC Production Growth Rate 2014-2019 (K Units) Figure India 3D IC and 2.5D IC Production Value Growth Rate 2014-2019 (Million USD) Figure Southeast Asia 3D IC and 2.5D IC Production Growth Rate 2014-2019 (K Units) Figure Southeast Asia 3D IC and 2.5D IC Production Value Growth Rate 2014-2019 (Million USD) Table Global 3D IC and 2.5D IC Consumption by Regions 2014-2019 (K Units) Table Global 3D IC and 2.5D IC Consumption Market Share by Regions 2014-2019 Figure Global 3D IC and 2.5D IC Consumption Market Share by Regions 2014-2019 Figure Global 3D IC and 2.5D IC Consumption Market Share by Regions in 2018 Figure United States 3D IC and 2.5D IC Consumption Growth Rate (2014-2019) (K Units) Table United States 3D IC and 2.5D IC Consumption by Type (2014-2019) (K Units) Figure United States 3D IC and 2.5D IC Consumption Market Share by Type in 2019 Table United States 3D IC and 2.5D IC Consumption by Application (2014-2019) (K Units) Figure United States 3D IC and 2.5D IC Consumption Market Share by Application in 2019 Figure European Union 3D IC and 2.5D IC Consumption Growth Rate (2014-2019) (K Units) Table European Union 3D IC and 2.5D IC Consumption by Type (2014-2019) (K Units) Figure European Union 3D IC and 2.5D IC Consumption Market Share by Type in 2019 Table European Union 3D IC and 2.5D IC Consumption by Application (2014-2019) (K Units) Figure European Union 3D IC and 2.5D IC Consumption Market Share by Application in 2019 Figure China 3D IC and 2.5D IC Consumption Growth Rate (2014-2019) (K Units) Table China 3D IC and 2.5D IC Consumption by Type (2014-2019) (K Units) Figure China 3D IC and 2.5D IC Consumption Market Share by Type in 2019 Table China 3D IC and 2.5D IC Consumption by Application (2014-2019) (K Units) Figure China 3D IC and 2.5D IC Consumption Market Share by Application in 2019 Figure Rest of World 3D IC and 2.5D IC Consumption Growth Rate (2014-2019) (K Units) Table Rest of World 3D IC and 2.5D IC Consumption by Type (2014-2019) (K Units) Figure Rest of World 3D IC and 2.5D IC Consumption Market Share by Type in 2019 Table Rest of World 3D IC and 2.5D IC Consumption by Application (2014-2019) (K Units) Figure Rest of World 3D IC and 2.5D IC Consumption Market Share by Application in 2019 Figure Japan 3D IC and 2.5D IC Consumption Growth Rate (2014-2019) (K Units) Figure Korea 3D IC and 2.5D IC Consumption Growth Rate (2014-2019) (K Units) Figure India 3D IC and 2.5D IC Consumption Growth Rate (2014-2019) (K Units) Figure Southeast Asia 3D IC and 2.5D IC Consumption Growth Rate (2014-2019) (K Units) Table TSMC (Taiwan) Company Details Table TSMC (Taiwan) Description and Business Overview Table TSMC (Taiwan) 3D IC and 2.5D IC Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019) Table TSMC (Taiwan) 3D IC and 2.5D IC Production Growth Rate (2014-2019) Table TSMC (Taiwan) 3D IC and 2.5D IC Production Market Share in Global Market Table TSMC (Taiwan) Recent Development Table Samsung (South Korea) Company Details Table Samsung (South Korea) Description and Business Overview Table Samsung (South Korea) 3D IC and 2.5D IC Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019) Table Samsung (South Korea) 3D IC and 2.5D IC Production Growth Rate (2014-2019) Table Samsung (South Korea) 3D IC and 2.5D IC Production Market Share in Global Market Table Samsung (South Korea) Recent Development Table Toshiba (Japan) Company Details Table Toshiba (Japan) Description and Business Overview Table Toshiba (Japan) 3D IC and 2.5D IC Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019) Table Toshiba (Japan) 3D IC and 2.5D IC Production Growth Rate (2014-2019) Table Toshiba (Japan) 3D IC and 2.5D IC Production Market Share in Global Market Table Toshiba (Japan) Recent Development Table ASE Group (Taiwan) Company Details Table ASE Group (Taiwan) Description and Business Overview Table ASE Group (Taiwan) 3D IC and 2.5D IC Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019) Table ASE Group (Taiwan) 3D IC and 2.5D IC Production Growth Rate (2014-2019) Table ASE Group (Taiwan) 3D IC and 2.5D IC Production Market Share in Global Market Table ASE Group (Taiwan) Recent Development Table Amkor (U.S.) Company Details Table Amkor (U.S.) Description and Business Overview Table Amkor (U.S.) 3D IC and 2.5D IC Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019) Table Amkor (U.S.) 3D IC and 2.5D IC Production Growth Rate (2014-2019) Table Amkor (U.S.) 3D IC and 2.5D IC Production Market Share in Global Market Table Amkor (U.S.) Recent Development Table UMC (Taiwan) Company Details Table UMC (Taiwan) Description and Business Overview Table UMC (Taiwan) 3D IC and 2.5D IC Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019) Table UMC (Taiwan) 3D IC and 2.5D IC Production Growth Rate (2014-2019) Table UMC (Taiwan) 3D IC and 2.5D IC Production Market Share in Global Market Table UMC (Taiwan) Recent Development Table Stmicroelectronics (Switzerland) Company Details Table Stmicroelectronics (Switzerland) Description and Business Overview Table Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019) Table Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Production Growth Rate (2014-2019) Table Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Production Market Share in Global Market Table Stmicroelectronics (Switzerland) Recent Development Table Broadcom (U.S.) Company Details Table Broadcom (U.S.) Description and Business Overview Table Broadcom (U.S.) 3D IC and 2.5D IC Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019) Table Broadcom (U.S.) 3D IC and 2.5D IC Production Growth Rate (2014-2019) Table Broadcom (U.S.) 3D IC and 2.5D IC Production Market Share in Global Market Table Broadcom (U.S.) Recent Development Table Intel (U.S.) Company Details Table Intel (U.S.) Description and Business Overview Table Intel (U.S.) 3D IC and 2.5D IC Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019) Table Intel (U.S.) 3D IC and 2.5D IC Production Growth Rate (2014-2019) Table Intel (U.S.) 3D IC and 2.5D IC Production Market Share in Global Market Table Intel (U.S.) Recent Development Table Jiangsu Changjiang Electronics (China) Company Details Table Jiangsu Changjiang Electronics (China) Description and Business Overview Table Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019) Table Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Production Growth Rate (2014-2019) Table Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Production Market Share in Global Market Table Jiangsu Changjiang Electronics (China) Recent Development Table Global 3D IC and 2.5D IC Capacity, Production Forecast 2019-2025 (K Units) Figure Global 3D IC and 2.5D IC Capacity Forecast 2019-2025 (K Units) Figure Global 3D IC and 2.5D IC Production Forecast 2019-2025 (K Units) Figure Global 3D IC and 2.5D IC Production Value Forecast 2019-2025 (Million US$) Table Global 3D IC and 2.5D IC Production Value Forecast 2019-2025 (Million US$) Table Global 3D IC and 2.5D IC Production Forecast by Regions 2019-2025 (K Units) Table Global 3D IC and 2.5D IC Production Market Share Forecast by Regions 2019-2025 Table Global 3D IC and 2.5D IC Production Value Forecast by Regions 2019-2025 (Million US$) Table Global 3D IC and 2.5D IC Consumption Forecast by Regions 2019-2025 (K Units) Table Global 3D IC and 2.5D IC Consumption Market Share Forecast by Regions 2019-2025 Table United States 3D IC and 2.5D IC Production and Production Value Forecast 2019-2025 (K Units) & (Million US$) Figure United States 3D IC and 2.5D IC Production Growth Forecast 2019-2025 (K Units) Table United States 3D IC and 2.5D IC Production Value Forecast 2019-2025 (Million US$) Figure United States 3D IC and 2.5D IC Consumption Forecast 2019-2025 (K Units) Table European Union 3D IC and 2.5D IC Production and Production Value Forecast 2019-2025 (K Units) & (Million US$) Figure European Union 3D IC and 2.5D IC Production Growth Forecast 2019-2025 (K Units) Table European Union 3D IC and 2.5D IC Production Value Forecast 2019-2025 (Million US$) Figure European Union 3D IC and 2.5D IC Consumption Forecast 2019-2025 (K Units) Table China 3D IC and 2.5D IC Production and Production Value Forecast 2019-2025 (K Units) & (Million US$) Figure China 3D IC and 2.5D IC Production Growth Forecast 2019-2025 (K Units) Table China 3D IC and 2.5D IC Production Value Forecast 2019-2025 (Million US$) Figure China 3D IC and 2.5D IC Consumption Forecast 2019-2025 (K Units) Figure Japan 3D IC and 2.5D IC Production Growth Forecast 2019-2025 (K Units) Figure Japan 3D IC and 2.5D IC Consumption Forecast 2019-2025 (K Units) Figure Korea 3D IC and 2.5D IC Production Growth Forecast 2019-2025 (K Units) Figure Korea 3D IC and 2.5D IC Consumption Forecast 2019-2025 (K Units) Figure India 3D IC and 2.5D IC Production Growth Forecast 2019-2025 (K Units) Figure India 3D IC and 2.5D IC Consumption Forecast 2019-2025 (K Units) Figure Southeast Asia 3D IC and 2.5D IC Production Growth Forecast 2019-2025 (K Units) Figure Southeast Asia 3D IC and 2.5D IC Consumption Forecast 2019-2025 (K Units) Table Global 3D IC and 2.5D IC Production Forecast by Type 2019-2025 (K Units) Figure Global 3D IC and 2.5D IC Production Forecast by Type 2019-2025 (K Units) Figure Global 3D IC and 2.5D IC Production Market Share Forecast by Type 2019-2025 Table Global 3D IC and 2.5D IC Production Value Forecast by Type 2019-2025 (Million US$) Figure Global 3D IC and 2.5D IC Production Value Forecast by Type 2019-2025 (Million US$) Figure Global 3D IC and 2.5D IC Production Value Market Share Forecast by Type 2019-2025 Table Global 3D IC and 2.5D IC Consumption Forecast by Application 2019-2025 (K Units) Figure Global 3D IC and 2.5D IC Consumption Forecast by Application 2019-2025 (K Units) Figure Global 3D IC and 2.5D IC Consumption Market Share Forecast by Application 2019-2025 Figure 3D IC and 2.5D IC Value Chain Table 3D IC and 2.5D IC Distributors List Table 3D IC and 2.5D IC Customers List Table Porter's Five Forces Analysis Table Research Programs/Design for This Report Figure Bottom-up and Top-down Approaches for This Report Figure Data Triangulation Table Key Data Information from Secondary Sources Table Key Data Information from Primary Sources

This research study involved the extensive usage of both primary and secondary data sources.  The research process involved the study of various factors affecting the industry, including the government policy, market environment, competitive landscape, historical data, present trends in the market, technological innovation, upcoming technologies and the technical progress in related industry, and market risks, opportunities, market barriers and challenges. Top-down and bottom-up approaches are used to validate the global market size market and estimate the market size for manufacturers, regions segments, product segments and applications (end users). All possible factors that influence the markets included in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data. The market size for top-level markets and sub-segments is normalized, and the effect of inflation, economic downturns, and regulatory & policy changes or other factors are not accounted for in the market forecast. This data is combined and added with detailed inputs and analysis from QYResearch and presented in this report.
 

After complete market engineering with calculations for market statistics; market size estimations; market forecasting; market breakdown; and data triangulation, extensive primary research was conducted to gather information and verify and validate the critical numbers arrived at. In the complete market engineering process, both top-down and bottom-up approaches were extensively used, along with several data triangulation methods, to perform market estimation and market forecasting for the overall market segments and sub segments listed in this report. Extensive qualitative and further quantitative analysis is also done from all the numbers arrived at in the complete market engineering process to list key information throughout the report.
 

Secondary Sources occupies Approximately 25% of Sources, such as press releases, annual reports, Non-Profit organizations, industry associations, governmental agencies and customs data, and so on; This research study involved the usage of widespread secondary sources; directories; databases such as Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), TRADING ECONOMICS, and avention; Investing News Network; statista; Federal Reserve Economic Data; annual reports; BIS Statistics; ICIS; company house documents; CAS(American Chemical Society); investor presentations; and SEC filings of companies. Secondary research was used to identify and collect information useful for the extensive, technical, market-oriented, and commercial study of the Light Aircraft market. It was also used to obtain important information about the top players, market classification and segmentation according to industry trends to the bottom-most level, and key developments related to market and technology perspectives.
 

In the primary research process, various sources from both the supply and demand sides were interviewed to obtain qualitative and quantitative information for this report. The primary sources from the supply side include product manufacturers (and their competitors), opinion leaders, industry experts, research institutions, distributors, dealer and traders, as well as the raw materials suppliers and producers etc.
 

The primary sources from the demand side include industry experts such as business leaders, marketing and sales directors, technology and innovation directors, supply chain executive, end users (product buyers), and related key executives from various key companies and organizations operating in the global market.
 

Primary research was conducted to identify segmentation types, product price range, product applications, key players, raw materials supply and the downstream demand, industry status and outlook, and key market dynamics such as risks, influence factors, opportunities, market barriers, industry trends, and key player strategies.
 

Other Reports by QY Research

Global (United States, European Union and China) Horticulture Light Market Research Report 2019-2025

Horticulture Light is the process of producing agricultural crops within a structured shelter so as to provide customized growing conditions to the crops. The majority of greenhouse structures are made from plastic followed by glass and other materia...

Global (United States, European Union and China) Rotary Torque Transducers Market Research Report 2019-2025

Rotary Torque Transducer a device used for measuring the torque on a rotating system such as the tightening torque applied by continuous and impulse power tools. In 2019, the market size of Rotary Torque Transducers is xx million US$ and it will rea...

Global (United States, European Union and China) Roof Paint Market Research Report 2019-2025

Roof Paint is white or special reflective pigments that reflect sunlight. On the basis of region, North America is the largest market segment of Roof Paint, Asia-Pacific region has great market potential in the future. In 2019, the market size of R...

Global (United States, European Union and China) Precious Metals in Additive Manufacturing Market Research Report 2019-2025

A precious metal is a rare, naturally occurring metallic chemical element of high economic value. Chemically, the precious metals tend to be less reactive than most elements (see noble metal). They are usually ductile and have a high lustre. Historic...

Global (United States, European Union and China) Photoelectric Coupler Market Research Report 2019-2025

In 2019, the market size of Photoelectric Coupler is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025,...

New Semiconductor and Electronics Reports